Silicon Resin
Telephone Bargaining
Solid Content :(150℃, 2h, %) 50±1 Drying Time :(200℃, Copper Sheet, h) ≤2 Viscosity:(Tu-4 Cup, 25℃, S) ≥15 Heat Resistance :(200℃, hour) ≥300 Heat Loss :(400℃, 3h,%) ≤5 Breakdown Strength:(KV/mm)Normal State (20±5℃)≥55 High Temperature :(200±2℃)≥30 Become Damp: (20±5℃, Relative Humidity 95±3% after 24 hours)≥35 Volume resistance:(Ω·cm)Normal State (20±5℃)≥1018 High Temperature(200±2℃) ≥1011 Become Damp (20±5℃, Relative Humidity 95±3% after 24 hours) ≥1012
Industry Category | Chemicals/Other-Chemicals |
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